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  avago technologies - 1 - description the avago technologies' ACFM-2013 is a quadplexer that combines band 1 and band 3 duplexers into a single, miniature package. the ACFM-2013 features a single antenna connection, which eliminates the need for antenn a switching. high isolation between bands enables the use of carrier aggregation. the ACFM-2013 is designed with avago technologies' film bulk acoustic resonator (fbar) technology. the ACFM-2013 also uses avago technologies' innovative microcap bonded-wafer, chip scale packaging technology. this process allows the filters to be assembled in a module with a footprint of only 3.6 mm 2 mm with a maximum height of 0.80 mm. low tx insertion loss of the ACFM-2013 reduces power amplifier current, which extends battery life. the ACFM-2013 enhances receiver sensitivity and dynamic range with low rx insertion loss and high rejection of tx signals at the rx ports. the excellent power handling capability of avago technologies' fbar bulk-mode resonators supports the high power levels used in mobile communications devices while adding virtually no distortion. features ? single antenna ? band 1 and band 3 carrier aggregation ? high cross band isolation enables carrier aggregation ? miniature size 3.6 x 2 mm footprint 0.80 mm maximum height ? environmental rohs 6 compliant halogen free tbbpa free ? high power rating +31 dbm maximum tx power applications smartphones, tablets, and mo bile/portable communications devices operating in bands 1 and 3. functional block diagram ordering information part number number of devices container ACFM-2013-blk 100 tape strip or gel-pack ACFM-2013-tr1 3000 178 mm (7-inch) reel #boe5y 1psu 1jo
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#boe %vqmfyfs #boe %vqmfyfs ACFM-2013 band 1/band 3 quadplexer product brief
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. all other brand and product names may be trademarks of their respective companies. data subject to change. copyright ? 2015 avago technologies. all rights reserved. av02-4908en C 2015-05-01 package dimensions and marking specification pin description pin connection 1band 1 rx 4band 3 rx 8band 1 tx 11 band 3 tx 13 ant 2, 3, 5, 6, 7, 9, 10, 12, 14, 15 gnd 1.600 x 0.750 0.25 x 45 chamfer 0.400 x 0.250 (14x) 0.500 1.500 0.750 3.000 1.500 (ref) 0.750 (ref) 0.750 0.05 2.000 0.075 ant b3 rx 3.600 0.075 b3 tx b1 tx b1 rx pin 1 mark oxide layer over ground metal (see notes) 1 14 13 12 11 10 9 87 15 2 3 4 5 6 mfiyww ddxxxx vago notes: 1. dimensions in millimeters 2. tolerance, unless otherwise noted: x.xx 0.05 mm x.xxx 0.025 mm 3. dimensions nominal unless otherwise noted 4. angles 45 nominal 5. contact areas are gold plated 6. ground pads on bottom metal are solder mask defined by means of a thin (< 1m) oxide layer top view bottom view side view package marking code: avago = avago technologies, inc. m = ACFM-2013 f = avago fbar technology i = assembly information y = year ww = work week dd = date code xxxx = assembly lot


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